This post was written by Mulah Johnson
Hewlett Packard has released a new ProLiant blade enclosure with higher server densities designed for cloud computing and other computing-intensive applications. The new blade, named as HP ProLiant BL2×220c G5, offers double the density of its HP predecessors by fitting two servers into each slot. While cloud computing applications are likely to benefit, the blade is targeted at multiple use cases, such as oil and gas producers who need computing power for geophysical surveys.
